Skip to main content

PCB & Connectors

contact us
PCB miniaturization

PCBs and Connectors

Circuitry is all about getting the power and control signals through. With increased power consumption and complexity, high frequency signals, and the necessity for miniaturisation, there is a requirement for high reliability circuitry which can handle these demands.

With the influx of electronics due to the move to autonomous driving and the electrification of vehicles, there is strong pressure to create high reliability circuitry which can work in harsh environments. Added to that is the need for materials which are mass production proven.  Our circuitry technology provides cleaning, plating and innerlayer bonding solutions for all types of printed circuit boards including rigid, flex and formable. Our plating knowledge has enabled gains in connector technology, plating on plastic and creating conductive surfaces on many dielectric materials.

Increased power in circuitry means dealing with thermal management concerns. An excellent solution is to build more copper into the PCB, enabling the substrate to pull away heat from the components. Our production proven technology MacuSpec VF-TH 200 will simultaneously fill vias and plate thru-holes of up to 5:1 aspect ratio, with electrolytic copper, on a wide range of structure sizes with great physical properties. Another solution is our single step thru-hole fill, MacuSpec THF 100.

Miniaturisation is becoming ever more necessary in automotive, as dimensions set for electronic components by car makers become smaller. Our expertise encompasses solutions such as via fill copper metallization MacuSpec AVF-700, which enables customers to plate a wide variety of blind micro via sizes in just one bath, without the need of flash plate and the ability to use direct metallization solutions.

Electronics features requiring high speed, low loss substrates can rely on M-Speed HF Copper Treatment for High Speed Innerlayers, a production proven surface treatment technology for innerlayer technologies. It provides low surface profiles and reliable adhesion for high frequency applications.

As the automotive landscape changes, the role of the final finish continues to provide durability and function for both PCB and connector. Our offer addresses the need for production proven solutions and reliability over the life span of the electronics. With the move to lead free we have developed and launched alternative for PCB finishes such as ORMECON CSN immersion tin and ENTEK PLUS HT OSP which adhere to automotive standards. For connectors we provide whisker mitigating solutions such as silver tin and M-Contact IN-2000 indium electrolytes. Mechanical bondable connectors can rely on AUTRONEX, a process which reduce gold consumption, increase throughput, and deliver consistent and uniform deposition rates.