A global automotive materials specialist has demonstrated the reliability benefits of a unique alloy substance that can replace traditional tin/silver/copper (SAC) alloys in the design of Advanced Driver Assistance Systems (ADAS). Internal tests suggest that this alternative alloy can play a significant role in helping automotive OEMs eliminate the risk of solder fractures, a potential cause of failure in ADAS hardware.
MacDermid Alpha Electronics Solutions held a series of quality tests to assess the reliability of Innolot alloys compared to conventional SAC and tin-silver (SnAg) alloys. The Innolot alloy was developed with the automotive industry for use in high temperature environments where vibration is also a factor. It is designed to offer significantly improved creep resistance, particularly when operating in temperature extremes such as within an ADAS circuit board assembly.
What did the quality tests prove?
“We ran a series of thermal cycling tests, pitting Innolot against the traditional SAC alloy. For this, we tested the alloy on two different ball grid arrays (BGAs), which are surface mount packages being used more in advanced safety designs,” explained Lenora Clark, Director of Autonomous Driving and Safety Technology at MacDermid Alpha Electronics Solutions.
“Our testing demonstrates that the size of the package, the pitch and the overall input and output does influence the characteristic life of the solder joint. Using both a 228 BGA and 256 BGA, the Innolot alloy improved solder joint reliability by a defined percentage when compared to the traditional SAC alloy. The percentile difference was 39% for the 228 BGA and 16.3% for the 256 BGA. This is a significant difference in reliability.”